USA, Chicago: bedra has introduced its latest high-performance copper alloy solutions at IEEE PES T&D 2026 in Chicago, focusing on the growing demands of AI infrastructure and power systems.
As AI computing expands, data centres are facing higher power densities and increased heat loads, while electricity networks are also under greater pressure. In this context, material performance is becoming more important for efficiency and reliability.
In high-density data centres, greater rack power is driving wider use of liquid cooling. bedra’s high-purity copper is used in cooling plates to improve heat dissipation from GPUs and CPUs. Its Powerway alloys show strong resistance to softening at high temperatures and offer more than 30 % higher post-brazing strength compared to pure copper, supporting smaller and more robust components.
The company’s oxygen-free copper reaches up to 101 % IACS conductivity, helping reduce voltage drop and energy losses. Good formability allows compact cabinet designs, while precise tolerances ensure compatibility with OCP standards. Optional silver or tin plating can further enhance performance.
Beyond data centres, bedra’s materials are applied in medium- and high-voltage equipment. Alloys such as bedra18200 (Cu-Cr) provide a balance of conductivity and strength, suitable for contacts and current-carrying parts. bedra18150 (Cu-Cr-Zr) offers improved resistance to creep and high-temperature conditions, while bedra10100 (Cu-OFE) is used in vacuum interrupters to support reliable operation.
Production is supported by a facility in Vietnam with a capacity of 50,000 t per year, alongside multiple quality and environmental certifications.
Source: Taiwan News
